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Field
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particular emphasis on printed circuit boards (PCBs) or life consumption monitoring and DPPs. The roles will involve designing product architectures that enable efficient disassembly, testing, and reuse
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, advanced packaging, backside power delivery networks, and chiplet-based architectures require new methodologies to model and optimize system behaviour beyond the traditional chip boundary. You will develop
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packaging, where EISLAB is responsible for the packaging part within a European consortium. Subject description Cyber-Physical Systems focuses on integrated software and application architectures with
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tissues using nanoCT; characterization of fibrous biomaterial scaffolds, including porosity, fiber architecture and structural stability; standardization and computational analysis of biomedical imaging
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, annotators, and underlying neural architectures. The ultimate goal is to produce argument mining tools that are more robust, generalizable, and fair, applicable to sensitive domains such as the analysis
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containing CO2-negative SCMs, bio-based self-healing, hybrid fiber architecture, Fe-SMA-based self-prestressing, and integrated structural health monitoring into one coherent system for thin, durable
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responsible for the packaging part within a European consortium. Subject description Cyber-Physical Systems focuses on integrated software and application architectures with implementations of massively
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their compatibility with different implant architectures and surface modifications. Evaluate antimicrobial activity: Investigate the ability of nanozyme-coated surfaces to inhibit bacterial growth and biofilm formation
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(neural networks, model training and evaluation). Graph neural networks (GNN) or other current architectures (e.g. transformers). Causal inference or computer networks. Interpretability of AI (mechanistic
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science » Computer architecture Computer science » Computer hardware Computer science » Computer systems Computer science » Programming Researcher Profile First Stage Researcher (R1) Application Deadline 31 Aug 2026