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Field
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, wafer processing, adhesion, or semiconductor-related materials. You are familiar with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared
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Are you passionate about organic electronic materials and doped conjugated polymers, and how they connect processing, microstructure, and electrical performance? Prof. Derya Baran ’s research group
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-efficient wideband signal processing and programmability to accommodate different use cases are becoming essential. Increasingly, overall system performance is no longer limited solely by the front-end, but
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EPFL, the Swiss Federal Institute of Technology in Lausanne, is one of the most dynamic university campuses in Europe and ranks among the top 20 universities worldwide. The EPFL employs more than
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« (CNT) conducts research on 300 mm wafers for microchip manufacturers, suppliers, device manufacturers, and R&D partners. We offer process and technology developments as well as services at the ULSI
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electronic solutions for future AI-driven optical interconnects. Design, implement and characterize the most promising topology for driver and TIA in advanced semiconductor technology
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for back-end-of-line (BEOL) integration with CMOS. Key responsibilities include: • Develop and optimize ALD processes for oxide semiconductor channel materials (e.g., IGZO, ITO, IZO) and BEOL-compatible
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electronics and semiconductor industry. The Centre exists to accelerate the adoption and commercialisation of Heterogeneous Integration (HI) across the UK supply chain. A core activity of the Centre is to
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EPFL, the Swiss Federal Institute of Technology in Lausanne, is one of the most dynamic university campuses in Europe and ranks among the top 20 universities worldwide. The EPFL employs more than
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building of charge and ion transport processes in functional materials. Synthesis and processing of ceramic proton conductors, solid electrolytes and semiconductor photoelectrodes Structural characterization