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‘best-practices’ in semiconductor processing. Qualifications A successful candidate should have: M.S. or PhD in Physics, Electrical Engineering, Materials Science, or related Engineering discipline
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Microelectronics Research Intern to support research and applied engineering efforts in advanced semiconductor packaging, with a specific emphasis on 2.5D silicon (Si) interposer technologies. This position is based
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appropriate. Engage with IPAI programs, seminars, workshops, industry collaborations, and other institute-sponsored activities. Explore opportunities for technology translation, industry collaboration
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crucial contributions to emerging quantum device technology. Hands-on experience with developing new process steps and flows for semiconductor device fabrication is expected. Expertise in e-beam