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for high-aspect-ratio vertical interconnects characterise the results (SEM, AFM, XCT, optical microscopy) for geometric accuracy, durability and interfacial strength -validate scalability and
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interconnects characterise the results (SEM, AFM, XCT, optical microscopy) for geometric accuracy, durability and interfacial strength -validate scalability and sustainability: less material waste, better energy
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knowledge of building materials and be fluent in English. The following work or research experience will be an advantage: experience with cementitious materials, XRD with Rietveld analysis, SEM, TG, DSC
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fluent in English. The following work or research experience will be an advantage: experience with cementitious materials, XRD with Rietveld analysis, SEM, TG, DSC, micro-CT, particle size analysis
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selection criteria Hands-on experience with one or more advanced characterization techniques such as SEM, EBSD, FIB, and TEM Prior knowledge/experience in hydrogen embrittlement A record of peer-reviewed
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learning, and logical reconstruction techniques. The research investigates how multimodal imaging modalities - including scanning electron microscopy (SEM), photon emission microscopy (PEM), and focused ion
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-transfer materials. Develop device geometries compatible with low-temperature transport, TEM and surface-sensitive measurements. Perform electronic transport measurements and correlate them with TEM, SEM
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techniques such as SEM, EBSD, FIB, and TEM Prior knowledge/experience in hydrogen embrittlement A record of peer-reviewed publications in relevant scientific journals and/or conference presentations Personal
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characterization techniques (such as Raman spectroscopy, SEM, or XRD) hands-on experimental skills within sensors or functional/printed materials very good written and oral English skills (documented per NTNU
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sputtering, plasma analysis, as well as thin film characterization techniques like XRD, SEM, TEM, or XPS is beneficial. Fluent English spoken and written is required. Your workplace The Thin Film Physics