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-generation 3D chip integration. Where to apply Website https://www.academictransfer.com/en/jobs/364047/postdoc-position-on-wafer-bondi… Requirements Specific Requirements You have a PhD degree in materials
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estudios de grado y máster..............................................hasta 10 puntos Tesis doctoral en temática relacionada con el trabajo a realizar, reconstrucción 3D y localización a partir de imágenes
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. These studies focus in particular on health-related biomaterials, including functionalized wound dressings, targeted drug delivery systems, cancer-targeting nanoparticles, and 3D-printable biomimetic hydrogels
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interactions exist with the Karlsruhe Institute of Technology via the DFG-funded Excellence Cluster “3D Matter Made to Order” (3DMM2O). Heidelberg University invites applications for the following full-time
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than 18,500 people, including over 14,000 students and 4,000 researchers from more than 120 different countries. Postdoc position in 3D Computer Vision, remote sensing ... The Laboratory of Visual Intelligence
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antigens presented by MHC molecules. This curiosity-driven project develops cutting-edge AI technology for 3D TCR–pMHC modeling to improve neoantigen identification, TCR specificity prediction, and TCR
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health and quality of health care. For more information, see: www.umu.se/en/usbe/about-us/statistics/ . Work description The successful candidate will perform research within the externally funded project
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synchrotron or laboratory 3D diffraction imaging is considered as a significant advantage. Excellent English communication skills are also essential As a formal qualification, you must hold a PhD degree (or
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. Excellent written and spoken English. ADDITIONAL SKILL Experience with markerless motion capture, AI-based pose estimation, and multi-camera acquisition systems. Knowledge of computer vision, 3D
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releasing growth factors, chemotherapeutics and antibodies. These systems will be tested in vitro in a traditional 2D setting or, newly, in a semi-perfusion 3D system with preformed vasculature and