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Field
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master’s (or equivalency) + 2 years of directly related work experience. Preferences Hands-on experience with other process tool sets such as sputter and evaporative deposition, DRIE and RIE etch, spin
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/experience include: OM, SEM, EDS, XRD, AFM, or other materials characterization techniques Lithography, evaporation, sputtering, dry etching, wet etching, or other device processing steps in a cleanroom
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, structure, optical properties, and electrochemical and photoelectrochemical activity. Unique research facilities enable the deposition of thin material layers via magnetron sputtering and their thermal
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fabrication, including mask design, metal sputtering, laser or e-beam lithography, etching, and device integration Familiarity with thin-film materials (e.g., oxides, dielectrics, metals) and their integration
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, EDS, XRD, AFM, or other materials characterization techniques Lithography, evaporation, sputtering, dry etching, wet etching, or other device processing steps in a cleanroom environment Vacuum systems
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growth of thin films using CVD and related technique is preferred. Other knowledge of pulsed-laser deposition, sputtering deposition, photo- and electron beam lithography, and transport and
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, Sputtering or MOCVD systems for microelectronics and emerging sensor technologies. Key Responsibilities: Develop and optimize wafer-scale 2D materials, including TMDCs, MXenes, and MOFs, for microelectronics
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materials (sputtering, PLD, wet-chemistry approaches), lithography (optical, e-beam), magnetometry equipment (VSM, MOKE), electrochemistry (galvanostats), ferroelectric characterization of materials
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following areas: Transition-edge sensors (TESs) or kinetic inductance detectors (KIDs) Cleanroom microfabrication processes, including: Thin-film deposition (e.g., magnetron sputtering) Electron-beam
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degree (300 ETCS in total). - Knowledge in nanomaterials and nanoscience. - Knowledge of experimental techniques (sputtering, XRD, TEM, SEM, magnetometry, etc.). - Outstanding CV and, more importantly, a