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continual cuts alongside curriculum pressures, the educational outreach component of this research becomes even more significant. As a child’s opportunity to visit heritage buildings can be limited as it
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: Perceptions, Benefits, and Challenges in Higher Education’, International Journal of Educational Technology in Higher Education, 20. doi:10.1186/s41239-023-00411-8. Johri, A., Katz, A.S., Qadir, J. and Hingle
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Apply and key information Summary Artificial Intelligence (AI) is rapidly becoming a transformative technology in Higher Education, presenting opportunities and challenges for teaching and learning
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Essential criteria Applicants should hold, or expect to obtain, a First or Upper Second Class Honours Degree in a subject relevant to the proposed area of study. We may also consider applications from those who hold equivalent qualifications, for example, a Lower Second Class Honours Degree plus...
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students. Universal Journal of Educational Research, 66(6), 1141-1148. Deforche, B., Van Dyck, D., Deliens, T. and De Bourdeaudhuij, I. (2015) Changes in weight, physical activity, sedentary behaviour and
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Summary The Intelligent Systems Research Centre (ISRC) vision is to develop a bio-inspired computational basis for Artificial Intelligence. Our mission is to understand how the brain works at
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. (2014) Putting CLIL into practice. Brophy, J. (1999) Towards a model of the value aspects of motivation in education: Developing appreciation for particular learning domains and activities. Educational
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education settings has measurable benefits for children’s vision and behaviour. Plos One. Congdon, N., Zheng, M. et al. (2009) Prevalence and determinants of spectacle nonwear among rural Chinese secondary
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, but limited opportunity, to access Ulster University studies. The programme will provide students and young professionals with educational and training opportunities that will help their career
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technology in healthcare education: Towards a learner-centred approach. Future healthcare journal, 8(1), p.e79 Yuan, J., Hassan, S.S., Wu, J., Koger, C.R., Packard, R.R.S., Shi, F., Fei, B. and Ding, Y., 2023