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breakdown or electromigration). Compared to other imaging modalities such as electron microscopy, X-ray microscopy is non-destructive and hence ideally suited for in-situ and operando 3D imaging. However, at
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to 3D transistor architectures and stacked, hybrid-bonded devices, non-destructive, high-resolution 3D imaging is becoming a necessity. Unfortunately, current 3D X-ray nanoimaging methods
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breakdown or electromigration). Compared to other imaging modalities such as electron microscopy, X-ray microscopy is non-destructive and hence ideally suited for in-situ and operando 3D imaging. However, at
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building envelope performance Development of standardised test protocols for non-destructive assessment of building envelope elements Support for ongoing practical research on design for disassembly and