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probes for cryo- SPM Development and optimization of wafer-scale micro- and nanofabrication processes, including integration of sensing, actuation and electrical functionalities Mechanical, electrical and
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, non-destructive, high-resolution 3D imaging is becoming a necessity. Unfortunately, current 3D X-ray nanoimaging methods
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/2603.06760 . A potential target application is the design of model gliders to compete in FAI competitions such as https://www.fai.org/page/f5-electric-flight . Profile Potential candidates are expected to have
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years. In line with standard EPFL procedures, the contract is issued on a one-year basis and renewable annually, subject to satisfactory progress and institutional regulations. Project background