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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Atomic Scale Processing for future chips and energy. The central challenge is to design and control materials at the atomic scale to enable next-generation devices with unprecedented performance
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activities can include: Experimental characterization of spin coherence during shuttling Shuttling-compatible demonstration of high-fidelity qubit control Demonstration of shuttle-based Si/SiGe quantum chips
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position within a Research Infrastructure? No Offer Description Area of research: Scientific / postdoctoral posts Job description:Postdoc - scalable, shuttle-based spin-qubit quantum-chips The JARA-Institute
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photonic integrated chip. If successful, it will allow Raman-based sensing of materials and tissues in a mm-sized chip, which can be manufactured in volume and integrated in industrial and consumer
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healthcare has been limited by the cost and size of Raman spectrometers. Our group is developing a new concept for Raman sensing based on a photonic integrated chip. If successful, it will allow Raman-based
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existing on-chip photonic device platforms in collaboration with project partners. Design and execute operando experiments to probe structural dynamics and degradation during repeated switching. Analyze
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://chem.au.dk/AmorphousMatLab What you will do The postdoc will co-lead beamtime proposals and campaigns, and will work with existing on-chip photonic device platforms in collaboration with project partners
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Neurocompetent Multi-Segment Intestinal Organ-on-Chip Based on hiPSCs for Studying Intestinal Infectious Diseases), funded through the French national PEPR MED-OOC program, aims to develop a new generation of