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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Atomic Scale Processing for future chips and energy. The central challenge is to design and control materials at the atomic scale to enable next-generation devices with unprecedented performance
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photonic integrated chip. If successful, it will allow Raman-based sensing of materials and tissues in a mm-sized chip, which can be manufactured in volume and integrated in industrial and consumer
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healthcare has been limited by the cost and size of Raman spectrometers. Our group is developing a new concept for Raman sensing based on a photonic integrated chip. If successful, it will allow Raman-based
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Are you interested about sustainable semiconductor manufacturing? Join TU/e to pioneer circular manufacturing concepts for the next generation of photonic chips, working at the forefront
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. The experimental work will be performed in close collaboration with colleagues in the Applied Nanophotonics (ANP) department at the University of Twente. We would love to go beyond laboratory characterization and
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are developing the chips and sensors of the future, whilst also setting the foundations for the software technologies to run on this new generation of equipment – which of course includes AI. Meanwhile we
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grid, which our faculty is helping to make completely sustainable and future-proof. At the same time, we are developing the chips and sensors of the future, whilst also setting the foundations