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-generation 3D chip integration. Where to apply Website https://www.academictransfer.com/en/jobs/364047/postdoc-position-on-wafer-bondi… Requirements Specific Requirements You have a PhD degree in materials
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estudios de grado y máster..............................................hasta 10 puntos Tesis doctoral en temática relacionada con el trabajo a realizar, reconstrucción 3D y localización a partir de imágenes
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. These studies focus in particular on health-related biomaterials, including functionalized wound dressings, targeted drug delivery systems, cancer-targeting nanoparticles, and 3D-printable biomimetic hydrogels
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interactions exist with the Karlsruhe Institute of Technology via the DFG-funded Excellence Cluster “3D Matter Made to Order” (3DMM2O). Heidelberg University invites applications for the following full-time
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than 18,500 people, including over 14,000 students and 4,000 researchers from more than 120 different countries. Postdoc position in 3D Computer Vision, remote sensing ... The Laboratory of Visual Intelligence
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set of synthetic and spectroscopic tools that connect molecular structure and organization, their properties and function. This is what you are going to do Design and build flow setups using 3D printer
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antigens presented by MHC molecules. This curiosity-driven project develops cutting-edge AI technology for 3D TCR–pMHC modeling to improve neoantigen identification, TCR specificity prediction, and TCR
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health and quality of health care. For more information, see: www.umu.se/en/usbe/about-us/statistics/ . Work description The successful candidate will perform research within the externally funded project
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synchrotron or laboratory 3D diffraction imaging is considered as a significant advantage. Excellent English communication skills are also essential As a formal qualification, you must hold a PhD degree (or
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. Excellent written and spoken English. ADDITIONAL SKILL Experience with markerless motion capture, AI-based pose estimation, and multi-camera acquisition systems. Knowledge of computer vision, 3D