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-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and
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Electrical Engineering with focus on radio frequency 3+ years’ experience in 2.5/3D electromagnetic simulations and mmW circuit design Excellent knowledge of high-frequency technology and electromagnetic field
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-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and
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packaging (e.g. transmission lines, vias, solder balls) for high performance computing (HPC), radar sensing or wireless communication (e.g. 6G) applications Electromagnetic modeling, simulation and layout
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-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and
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-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and
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Fraunhofer MEVIS is a world-leading and internationally networked research and development center for computer support in digital medicine. It pursues a patient-centered approach tailored
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-frequency sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, mainly for sensing, communication, computing and security
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design Good knowledge of the Cadence design flow and implementation of the specification up to a complete circuit including layout, taking into account the electromagnetic field and parasitic effects Good