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Is the Job related to staff position within a Research Infrastructure? No Offer Description What you will do You evaluate through physical design experiments the impact of various technology options
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systems designs is more than ever essential to maintain performance increase together with power/area reduction in the next generations of chips. The Back-End-Of-Line (BEOL) interconnects is the metal
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to polish wafers to remove unwanted dielectric or metallic material and planarize its surface. As feature scaling in IC manufacturing continues, chemical and design-related device failure phenomena like
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will work closely with the device design, characterization and process development engineers and be responsible for defining and implementing the process options enabling Laser co-integration with Si
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advanced designs. Take the basic research flow and status, and drive improvement in consistency, uniformity, and stability. Apply known techniques or standards from industry to improve the effectiveness
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and stability, and the synthesis of novel interlayer materials. Gaining control over the crystallization of 2D halide perovskites. Design and synthesis of novel chiral perovskites. Development of a
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external customers, respond to questions with concise direct answers. Work to strengthen information needed for technology transfers. Work with Integration Engineers and Program management to design and
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point of contact for customers for collecting documentation and transferring information, besides setting up dedicated experiments. More specifically, your tasks include: Design, conduct and analyse your
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transferring information, besides setting up dedicated experiments. More specifically, your tasks include: Design, conduct and analyse your experiments. Actively contribute to the research and joint development
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carrying out development plans. This includes defining the design of experiment, defining the in-line characterization strategy, following-up the processing in the imec pilot line, and analyzing and