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Field
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metallic additive manufacturing, including powder bed fusion technologies experience in advanced materials characterisation techniques such as SEM, EBSD, TEM, PFIB and atom probe tomography strong knowledge
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fluorescence microscopy, Confocal laser scanning microscopy, Cryo-TEM and/or TEM, SEM, DLS, NTA, Zeta potential, SAXS/SANS, Fluorescence spectroscopy…). Experience in quantitative image analysis and microscopy
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· demonstrated expertise in advanced microscopy and microanalysis techniques, particularly atom probe tomography (APT) · experience with complementary characterisation techniques such as TEM, SEM, EBSD and
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characterization techniques, such as SEM, TEM, EBSD, XRD, and related methods. Experience preparing specimens using techniques and tools such as electropolishing, flash polishing, and focused ion beam methods
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structure–property relationships and advancing the understanding of these novel catalytic systems. Perform electron microscopy analyses, including transmission electron microscopy (TEM) and in situ TEM
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micromechanical behavior under loading conditions (e.g., tension, compression, creep). Perform detailed microstructural characterization using SEM, EBSD, TEM, XRD, and related techniques. Analyze lattice strain
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | 15 days ago
candidate with strong cleanroom fabrication tool experience, particularly in materials characterization methods such as ellipsometry, AFM, SEM, TEM, XRD, SIMS, or related techniques. Experience with
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. Structural, chemical, and morphological characterization (X-ray diffraction – DRX, scanning electron microscopy – SEM, transmission electron microscopy – TEM, Raman spectroscopy, Fourier transform infrared
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of the DBSCI (imaging platforms of the LPCV, IBS, PFNC, equipped with instruments such as FIB-SEM and cryo-TEM, etc.). You will work in close collaboration with IBS to build a local network aimed at developing
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solid-state NMR • Electron microscopy (SEM, TEM) • Chromatography (HPLC, SEC) • X-ray diffraction • UV-Visible and IR spectroscopy • Light scattering • Material characterization equipment (DSC, TGA, DVS