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Field
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dynamics simulations to understand the growth mechanisms of thin films deposited by magnetron sputtering, with or without ion beam assistance (IBAS), particularly for metallic materials (Ag) and oxides (ZnO
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cleanroom facility. Deep expertise in lithography, E-beam evaporation, sputtering, and dry/wet etching is strictly required. Optical Bench Competency: Demonstrated success in designing, constructing, and
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Additional Information Eligibility criteria • PhD in experimental physics or a related field • Experience in cryogenics appreciated • Experience in thin film deposition by sputtering desirable • Experience in
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fabrication, including mask design, metal sputtering, laser or e-beam lithography, etching, and device integration Familiarity with thin-film materials (e.g., oxides, dielectrics, metals) and their integration
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growth of thin films using CVD and related technique is preferred. Other knowledge of pulsed-laser deposition, sputtering deposition, photo- and electron beam lithography, and transport and
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, Sputtering or MOCVD systems for microelectronics and emerging sensor technologies. Key Responsibilities: Develop and optimize wafer-scale 2D materials, including TMDCs, MXenes, and MOFs, for microelectronics
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materials (sputtering, PLD, wet-chemistry approaches), lithography (optical, e-beam), magnetometry equipment (VSM, MOKE), electrochemistry (galvanostats), ferroelectric characterization of materials
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following areas: Transition-edge sensors (TESs) or kinetic inductance detectors (KIDs) Cleanroom microfabrication processes, including: Thin-film deposition (e.g., magnetron sputtering) Electron-beam
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(KIDs) Experience with cleanroom microfabrication processes, including thin-film deposition (e.g., magnetron sputtering), electron-beam or optical lithography, and dry/wet etching Familiarity with
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heterostructures using sputter deposition ABOUT THE PROJECT AND THE DYNAMAT GROUP The ERC Consolidator Grant project THERMAGINE explores how thermal fluctuations drive magnetization switching in nanoscale magnetic