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19 Sep 2026 Job Information Organisation/Company CNRS Department Laboratoire des technologies de la microélectronique Research Field Engineering Physics Technology Researcher Profile Recognised
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EPFL, the Swiss Federal Institute of Technology in Lausanne, is one of the most dynamic university campuses in Europe and ranks among the top 20 universities worldwide. The EPFL employs more than
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engineering, substrate recovery strategies, manufacturing process development and process integration. The ultimate goal is to establish scalable and sustainable manufacturing methodologies that reduce material
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Neuromorphic computing is emerging as a key technology for future energy-efficient artificial intelligence. At Peter Grünberg Institute- Semiconductor Nanoelectronics (PGI-9) , we develop innovative
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | about 20 hours ago
operation. Field of Science: Engineering Advisors: April Jewell [email protected] (818) 354-3474 Questions about this opportunity? Please email [email protected] Point of Contact Mikeala Eligibility
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Project Overview Wafer-Scale Integrated Sensing Devices based on Optoelectronic Metasurfaces (WISDOM) focuses on semiconductor wafer growth and processing for photonic applications. This program
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| Electrical and Computer Engineering Position Description: Conducts advanced research and development in the Department of Electrical & Computer Engineering, with a primary focus on cathodoluminescence
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of application include sustainable energy, process technology and materials science, nanotechnology and technical medicine. As part of a people-first tech university that aims to shape society, individuals and
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18 Sep 2026 Job Information Organisation/Company ARCNL Research Field Engineering » Chemical engineering Engineering » Mechanical engineering Physics » Applied physics Physics » Thermodynamics
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, Mechanical Engineering, or a related discipline is required by the start date. The successful candidate should have clean room experience, along with a background in semiconductor packaging. Additional