Sort by
Refine Your Search
-
Category
-
Country
-
Program
-
Employer
- NIST
- National University of Singapore
- Nanyang Technological University
- Fraunhofer-Gesellschaft
- Delft University of Technology (TU Delft)
- Pennsylvania State University
- University of Sheffield
- North Carolina State University
- SINGAPORE INSTITUTE OF TECHNOLOGY (SIT)
- University of Texas at Austin
- CNRS
- Eindhoven University of Technology (TU/e)
- Texas A&m Engineering
- The Ohio State University
- University of Twente
- Northeastern University
- University of Texas at Arlington
- Forschungszentrum Jülich
- IMEC
- Oak Ridge National Laboratory
- Purdue University
- State University of New York University at Albany
- University of Central Florida
- University of Florida
- University of Oslo
- University of Oxford
- Argonne
- City University of Hong Kong (Dongguan)
- EPFL
- ETH Zurich
- Heriot Watt University
- King Abdullah University of Science and Technology
- Rochester Institute of Technology
- University of Arkansas
- University of Basel
- University of California, Merced
- University of Glasgow
- University of Nottingham
- University of Twente (UT)
- University of Warwick;
- AUSTRALIAN NATIONAL UNIVERSITY (ANU)
- Arizona State University
- Boise State University
- California Institute of Technology
- Cornell University
- Ghent University
- HFML-FELIX
- ICN2
- King's College London
- Kyoto Institute of Technology
- Kyushu University
- Lancaster University
- Munster Technological University
- National Aeronautics and Space Administration (NASA)
- National Research Council Canada
- RMIT University
- Tilburg University
- University of A Coruña
- University of Delaware
- University of Liverpool
- University of Michigan
- University of North Carolina at Charlotte
- University of Sheffield;
- University of Southern California
- University of Texas at Dallas
- Virginia Tech
- XIAN JIAOTONG LIVERPOOL UNIVERSITY (XJTLU)
- Zintellect
- ;
- ARCNL
- ARQUIMEA RESEARCH CENTER
- Aalborg University
- Atlantic Technological University;
- Austin Community College District
- Biophysical and Biomedical Measurement Group, National Institute of Standards and Technology
- Bowling Green State University
- Bridgewater State University
- COFUND QuanG
- Carnegie Mellon University
- Chalmers University of Technology
- ETH Zürich
- European Magnetism Association EMA
- European Space Agency
- FEUP
- George Mason University
- Grenoble INP - Institute of Engineering
- Helmholtz-Zentrum Berlin für Materialien und Energie
- Helmholtz-Zentrum Dresden-Rossendorf - HZDR - Helmholtz Association
- ICMAB
- Indiana University
- Institut Català de Nanociència i Nanotecnologia
- Institute of Photonic Sciences
- Institute of Science Tokyo
- KAUST
- KEK
- KNAW
- Kennesaw State University
- King's College London;
- Linköping University
- Loughborough University
- 90 more »
- « less
-
Field
-
-generation atom-beam lithography to enable the production of future quantum, nanoelectronic and nanophotonic devices and aid the expansion of the semiconductor lithography roadmap beyond EUV. The role combines
-
/robotics, critical infrastructure systems, critical industrial control systems, security infrastructures and cryptographic techniques for AI systems; and advanced manufacturing for future semiconductor and
-
collaborators. Strong candidates may bring experience in one or more of the following areas: Molecular doping of organic semiconductors Thermoelectrics, OFETs, OPVs, or related organic electronic devices
-
independent research programs in the field of wide bandgap semiconductor materials and devices with applications in power electronics, microwave electronics, optoelectronics and sensors. This position will be
-
NIST Nanostructure Fabrication and Measurement Group | Gaithersburg, Maryland | United States | about 23 hours ago
Traceable nanostructure measurements to make AI reliable for quantum and semiconductor manufacturing The Nanostructure Fabrication and Measurement Group in the Microsystems and Nanotechnology
-
Job Description The Department of Electrical and Computer Engineering (ECE), College of Design and Engineering, is seeking a Research Fellow to lead the process development and device fabrication
-
A PhD studentship is available for commencement October 2026 – January 2027 as part of the first Cohort of a new EPSRC Centre for Doctoral Training in UK Semiconductor Industry Future Skills* led by
-
packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit). Interpret fab metrology, defect, E-test yield, and evaluate silicon-to-simulation correlation accuracies
-
Overview CHIMES² — the Centre for Heterogeneous Integrated MicroElectronic and Semiconductor Systems — is one of the UK’s national semiconductor research-translation programmes, a £16.3M Innovation
-
Bioelectronics, organic semiconductors and anti-infective agents. Key Responsibilities: Design and synthesis of conjugated oligoelectrolyte materials for antimicrobial, bioimaging and drug delivery applications