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on palaeoecological research, including peatland fieldwork, peat-core analysis and multiproxy reconstruction of past fire and ecosystem responses, alongside FTIR spectroscopy and data integration. You will work closely
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Max Planck Institute for Chemical Energy Conversion, Mülheim an der Ruhr | M lheim an der Ruhr, Nordrhein Westfalen | Germany | 1 day ago
, surface science, etc. is an advantage) Experience working with flow cells, FTIR, as well as surface science techniques generally, is an advantage Readiness to learn and apply new experimental techniques
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, please visit the institute's website: https://www.is2m.uha.fr/ . The postdoctoral researcher will work within the Plasma Polymerization and Coatings team, under the scientific supervision of Dr. Aissam
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engineering, composite materials, high temperature resistant materials, ceramic precursor materials, environmental chemistry and materials. For more details, please view https://www.ntu.edu.sg/mse/research . We
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(e.g., FTIR, XRD, and Raman spectroscopy) to establish structure–property–performance relationships. Fabricate electrodes (buckypapers and cast films); assemble three-electrode half-cells and two
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related fields, with a strong publication record. Prior experience in flow-cell electrochemistry, in-situ spectroscopy (UV-Vis, Raman, FTIR), or 3D printing and polymer processing is desired. Good spoken
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characterization methods (e.g., SEM, XRD, BET, FTIR, Raman, DSC, TGA); 9) Experience in modeling and simulating chemical, catalytic, or electrochemical processes (e.g., MATLAB, COMSOL Multiphysics, ANSYS
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: Design and conduct laboratory experiments. Characterize materials using advanced analytical techniques (XRD, SEM-EDS, ICP-OES/ICP-MS, FTIR, Raman and thermal analysis). Process and statistically analyse
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-generation 3D chip integration. Where to apply Website https://www.academictransfer.com/en/jobs/364047/postdoc-position-on-wafer-bondi… Requirements Specific Requirements You have a PhD degree in materials
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Thin-film fabrication, processing optimization, and experimental troubleshooting Materials characterization using techniques such as GIWAXS, Raman, FTIR, UV-vis, and electrical transport measurements