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Position Description Tenure-Track Faculty Position in Applied Mathematics and Computational Modeling (2027–2028) IE University’s School of Science and Technology invites applications for a full
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12 Sep 2026 Job Information Organisation/Company Università degli Studi di Perugia Research Field Engineering Researcher Profile Recognised Researcher (R2) Leading Researcher (R4) First Stage
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community To find out more about research at Imperial College London in this area, go to: https://www.imperial.ac.uk/mechanical-engineering/research/ How to Apply For further details of the post contact Prof
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Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Wafer-to-wafer bonding is a key enabling technology for future 3D chip
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for Organoids, Liver, and Lab On-Chip' led by the industrial partner Fluigent and funded by BPI (Biotherapies and Bioproduction of Innovative Therapies programme), develop biological liver-on-a-chip models
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Department Information For additional information on our departments, please go to: Nursing and Health Innovation: https://www.uta.edu/academics/schools-colleges/conhi/academics Engineering: https
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website of the Faculty of Electrical Engineering, Mathematics and Computer Science. Conditions of employment This position is offered as an Academic Career Track position (0.8 – 1.0 FTE). During
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, or technology transfer office. *Knowledge of the European Chips Act and the specific funding mechanisms of the Chips Joint Undertaking (JU). Selection process https://www.ucd.ie/workatucd/jobs/ Website
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, or computer engineering, or a closely related field. Required Related Experience The successful candidate will have expertise in high-speed computational fluid dynamics with interest in turbulence and
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Ciência e Tecnologia, I.P. Fellowship Regulation of Fundação para Ciência e Tecnologia. For direct access to the FCT RBI go to the following link https://www.fct.pt/apoios/bolsas/regulamento.phtml.pt (Reg