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on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits for automotive
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you will design the next generation of energy-efficient digital integrated circuits, taking them from RTL to a fabricated chip and PCB that you measure in our own labs. The position is part of
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The University of Texas Southwestern Medical Center (UT Southwestern Medical Center) | Dallas, Texas | United States | about 17 hours ago
seeking a highly motivated and collaborative postdoctoral researcher to help develop the next generation of cancer immunotherapies. Our research integrates cancer immunology, T-cell and protein engineering
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Warsaw University of Technology/Centre for Advanced Materials and Technologies, CEZAMAT | Poland | 3 months ago
staff position within a Research Infrastructure? No Offer Description Role: Participation in a research project titled "Advanced Photonic Integrated Circuits Pilot Line for Europe – PIXEurope
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Warsaw University of Technology/Centre for Advanced Materials and Technologies, CEZAMAT | Poland | about 1 month ago
position within a Research Infrastructure? Yes Offer Description Role: Participation in a prestigious research project titled "Advanced Photonic Integrated Circuits Pilot Line for Europe – PIXEurope
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circuit models and algorithms for estimating the charge, health, and power based on direct methods (e.g. open circuit voltage), model-based methods (e.g. Kalman filtering), data driven methods (e.g. machine
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Link https://www.ubjobs.buffalo.edu/postings/63869 Employer Research Foundation Position Type RF Professional Job Type Full-Time Appointment Term Salary Grade E.89 Posting Detail Information Position
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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structures based on advanced packaging technologies and heterogeneous integration approaches (such as chiplet-based architectures), as well as the development of analog and mixed-signal integrated circuits
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for future compute systems. We work in close collaboration with other expertise centers in imec specializing in applications, technology, circuits and design to innovate and pathfind next-generation