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electron microscopy inspections. These inspections play a crucial role throughout the technology development cycle, providing wafer-level characterization of processes and materials used in both More-than
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, electrical engineering, physics or a related field. Knowledge of ASIC design and semiconductor development. Strong stakeholder management and communication skills. A customer-focused mindset and
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an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in
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of heterogeneous technologies are increasing the complexity of power delivery, thermal management, and energy optimization across the entire computing stack. Emerging technologies such as fine-grain 3D integration
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improvement initiatives, and representing the PVDPE organization in cross-functional collaborations. Through effective resource planning, talent development, and stakeholder management, you will help shape
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control probe-induced charging and energy shifts so that the true band structure can be measured with confidence. In this role, you will contribute to the development, validation and application of in
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links with low intercept probability from advanced MIMO/beamforming solutions). contribute to the design of transceiver architectures in cross-disciplinary teams. lead and execute (funded) projects
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will include: Collaborate with cross-functional teams in applications, technology, circuits and design (across imec) to define novel technology-aware network architectures. Lead feasibility studies