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of heterogeneous technologies are increasing the complexity of power delivery, thermal management, and energy optimization across the entire computing stack. Emerging technologies such as fine-grain 3D integration
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-on experimental development, advanced data analysis, interpretation of complex spectra and close interaction with process, integration and device experts. You will connect photoemission results with complementary
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, and performance analysis. You have a good understanding of optical or electrical circuit switching, and you are familiar with recent industry initiatives around Ultra-ethernet, CXL, UALink, etc. You
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environment, including automation, optimisation, parameter sweeps or data analysis. Ability to collaborate effectively across modelling, epitaxy, process, design and characterization disciplines, supported by