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, advanced packaging, backside power delivery networks, and chiplet-based architectures require new methodologies to model and optimize system behaviour beyond the traditional chip boundary. You will develop
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how materials, processing choices and stack design shape device behaviour. At the same time, this approach raises exciting scientific and technical challenges, including the need to understand and
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experiments to derive insights from complex system behavior. You are able to collaborate across abstraction layers, translating technology, circuit, and design information into meaningful architectural and
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