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at CHUV by verifying and validating robust software that contributes to various stages of therapy development (including: imagery, therapy optimisation, interface with the electrical stimulators, home use
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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. To apply, send: Your CV and Motivation letter Link(s) to one or two shipped/deployed projects, with a short note on what you personally built Your current location Two reference contacts Questions can be
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to 3D transistor architectures and stacked, hybrid-bonded devices, non-destructive, high-resolution 3D imaging is becoming a necessity. Unfortunately, current 3D X-ray nanoimaging methods
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. Experience in personalized electric-field modelling of tTIS using realistic human head models. Experience in personalized brain-temperature modelling for non-invasive brain stimulation using realistic human
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knowledge of English Good knowledge of current computer software (MS-Office) Experience in molecular biology, cell biology, animal physiology would be a plus We offer Excellent working conditions in a
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design, or a related field is required. Current Master’s students are also invited to apply for a research assistant position at a reduced FTE. We offer World-class and international research and training
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to the technical and quantitative training of junior lab members. Candidate profile Applicants should have a PhD in biomedical engineering, electrical engineering, computer science, data science, computational