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for developing and optimizing plasma-based functionalization processes for ferrimagnetic nanoparticles. The successful candidate will be responsible for investigating the relationships between plasma parameters
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) / InP contact layer (200 nm) / Si substrate The objective of the project is to develop a plasma etching process for this multilayer stack, enabling selective etch stopping on the InP contact layer, which
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postdoctoral position lies at the interface of fluid mechanics, phase-change physics, and industrial application. It is part of ARCNL’s Source Department and the EUV Plasma Processes group. We investigate
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The University of Nevada, Reno (UNR) appreciates your interest in employment at our growing institution. We want your application process to go smoothly and quickly. Final applications must be
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linking: PVD process → thin-film morphology → electrode microstructure → electrochemical behaviour → full-cell performance The two successful candidates will investigate how the morphology and physical
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— Ph.D. in plasma physics, physics, or a related field â— Experience participating in or running tokamak experimental campaigns â— Background in control, signal processing, or data analysis
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APPLICATION INSTRUCTIONS: CURRENT PENN STATE EMPLOYEE (faculty, staff, technical service, or student), please login to Workday to complete the internal application process . Please do not apply
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Selection process Pre-selection: Candidates will be assessed based on their CV, motivation, research experience and overall suitability for the proposed project. Interviews: Shortlisted candidates will be
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diversity of platforms and building blocks. The foundry model is now becoming established where Process Design Kits (PDKs) allow fabless designers to create their own chips with custom functionality. While
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processing for quantum and microelectronic device nanofabrication. Applicants must have (or expect to have at time of appointment) a Ph.D. in chemical engineering, physics, chemistry, or materials science