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thermal characterization of prototype devices, including measurements under vacuum and cryogenic conditions Integration and testing of probes in scanning probe instrumentation Collaboration with academic
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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