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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
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to 3D transistor architectures and stacked, hybrid-bonded devices, non-destructive, high-resolution 3D imaging is becoming a necessity. Unfortunately, current 3D X-ray nanoimaging methods
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to the technical and quantitative training of junior lab members. Candidate profile Applicants should have a PhD in biomedical engineering, electrical engineering, computer science, data science, computational