Sort by
Refine Your Search
-
Listed
-
Country
-
Employer
- Fraunhofer-Gesellschaft
- NIST
- North Carolina State University
- Indiana University
- National University of Singapore
- ;
- Argonne
- Purdue University
- University of Southern California
- University of Texas at Austin
- ETH Zurich
- European Space Agency
- McGill University
- National University of Science and Technology POLITEHNICA Bucharest
- Rochester Institute of Technology
- Texas A&M University System
- University of Copenhagen
- University of Florida
- University of Sheffield
- University of Zagreb, Faculty of Electrical Engineering and Computing
- Arizona State University
- CNR IMM
- DAAD
- Grenoble INP - Institute of Engineering
- Huazhong Agricultural University (HZAU)
- Marquette University
- Nanyang Technological University
- Pennsylvania State University
- SINGAPORE INSTITUTE OF TECHNOLOGY (SIT)
- Stony Brook University
- THE UNIVERSITY OF HONG KONG
- Technical University of Denmark;
- University College Cork
- University of Bath
- University of California
- University of Connecticut
- University of Glasgow
- University of Illinois at Urbana Champaign
- University of Michigan
- University of Salford;
- University of Sydney
- Universität Stuttgart
- Virginia Tech
- 33 more »
- « less
-
Field
-
services, and maintaining strong communication ties with other department units (external engagement, and IT services), ECE-relevant organized research units (e.g., Microelectronics Research Center and
-
, microelectronics, photonics, or related technology domains would be advantageous. • Experience in a university, research institute, government agency, corporate laboratory, or technology-related
-
with semiconductor technologies, advanced packaging, microelectronics, photonics, or related technology domains would be advantageous. • Self-motivated, resourceful, and able to work
-
years of experience with extensive expertise in microelectronics and microsystems technology. Our wide range of technologies spans from advanced semiconductor processes and MEMS technologies to innovative
-
portfolio includes robotic integration, automation and manufacturing process optimisation, while its Advanced Materials activities encompass microelectronics, photonics, sensors, semiconductor materials
-
. Qualifications You must have a Master of Science degree and a Ph.D. degree within a relevant field, such as Micro/Nanofabrication, Physics, Microelectronics, or similar. Industrial experience is a distinct
-
environment. In the Epitaxy Department, we are working on strengthening European semiconductor manufacturing capacity as part of our pilot line. We work closely with the Research Fab Microelectronics Germany
-
facility support, semiconductor, microelectronics, cleanroom, manufacturing, engineering laboratory, or comparable technical environment. Knowledge, Skills and Abilities: - Knowledge of laboratory
-
science, electronics, physics or related. 2+ years’ experience in microelectronics or MEMS. Experience in nanofabrication techniques including electron beam and optical lithography, dry and wet etching
-
and Techniques 59(1): 188, 2011 Database; Microelectronics; Machine learning; Data informatics; Physics; Terahertz; Metrology;