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activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). More specifically, you will: Define, organize and validate
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of flows. This activity touches a diverse range of programs, from very advanced CMOS, Si Photonics, 3D integration, and Tech Transfer needs. Take the basic research flow and status, and drive
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platformization: This activity touches a diverse range of programs, from very advanced CMOS, Si Photonics, 3D integration, and legacy Tech Transfer needs. Module Synergy activity: working on modules which are used
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Photonics, 3D integration, and Tech Transfer needs. Take the basic research flow and status, and drive improvement in consistency, uniformity, and stability. Module Synergy activity: working on modules which