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physical design experiments the impact of various technology options (device, standard cell architecture, back-end of line, etc.) on the power, performance, and area of different SoCs (or submodules thereof
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interconnect layers will be reduced to 20 nm pitches and below, requiring new materials and disruptive integration schemes, process innovations and structural scaling boosters (hybrid metallization, semi
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or similar fields, or equivalent experience, You have solid theoretical understanding of the electric properties and physics involved in electric actuation. You have practical experience in designing and
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