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, advanced packaging, backside power delivery networks, and chiplet-based architectures require new methodologies to model and optimize system behaviour beyond the traditional chip boundary. You will develop
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links with low intercept probability from advanced MIMO/beamforming solutions). contribute to the design of transceiver architectures in cross-disciplinary teams. lead and execute (funded) projects
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distributions in gate stacks. In-operando photoemission can add a powerful complementary perspective: by following energy-level shifts under applied bias and across different device architectures, it can reveal
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