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11 May 2024 Job Information Organisation/Company Ghent University Research Field Chemistry » Molecular chemistry Chemistry » Other Engineering » Materials engineering Engineering » Mechanical
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11 May 2024 Job Information Organisation/Company Ghent University Research Field Chemistry » Other Engineering » Materials engineering Engineering » Other Physics » Computational physics Physics
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3 May 2024 Job Information Organisation/Company Ghent University Research Field Biological sciences » Other Chemistry » Biochemistry Engineering » Other Medical sciences » Other Pharmacological
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microscopy, structural biology, technology development, and bioinformatics. VIB provides a highly interactive environment and ample training opportunities for its researchers. In addition, the VIB-UAntwerp
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26 Feb 2024 Job Information Organisation/Company University of Leuven Research Field All Researcher Profile First Stage Researcher (R1) Country Belgium Application Deadline 1 Apr 2024 - 00:00 (Africa/Abidjan) Type of Contract Not Applicable Job Status Not Applicable Is the job funded through the...
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), can continue logic transistor scaling to Angstrom technology nodes. They can largely benefit from adopting such selective deposition concept. Not in the least, one avoids electrically detrimental
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potential has proven to be a possible solution to overcome the limitations of silicon technology, where the combination of 2D materials with silicon chips promises to surpass the current technological
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Science, Material Science, Physics Science, Electrical Engineering with emphasis on semiconductor technology, nanotechnology or related field. LanguagesENGLISHLevelExcellent Additional Information Selection
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18 Mar 2024 Job Information Organisation/Company University of Liege Department UEE/Argenco Research Field Engineering » Civil engineering Researcher Profile First Stage Researcher (R1) Country
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processing for nanoelectronics applications Apply 2D layered Transition Metal Di-Chalcogenides (TMDCs) are envisioned for replacing silicon in advanced CMOS logic technology nodes, in the form of stacked