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Join a groundbreaking project at TU/e, partnering with ASML and M2i, to pioneer safer polymer materials for lithographic equipment. Drive innovation in semiconductor manufacturing and shape
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of performance of select designs in close collaboration with ASML, while in project 2 you will demonstrate salient mechanisms in optical experiments at AMOLF performed with help of a research technician. The
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environment surrounded by experts who share your enthusiasm? Are you excited about playing a leading role in supporting researchers achieve their goals? If your answer is a "yes" to these questions, we would
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Surface reactions on metal model catalysts in plasma environment Activation of molecules in a plasma can form the basis for efficient chemical reactions making direct use of electrical energy. The
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the Netherlands. The candidate is expected to closely collaborate with the project partners such as Vrije Universiteit, Saxion, TNO-ESI and industrial partners ASML, Canon Production Printers, ITEC, Philips, and
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diversity of lithography tools (incl. DUV ASML scanner, direct laser writing, optical and e-beam). Alongside many other state-of-the-art tools, we are consolidating a best-in-class pilot line infrastructure
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predict interfacial structures for your 2D material/oxide materials interfaces, directly taking into account disorder and non-ideal structures, as well as environmental factors. Using these new models, you
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challenges faced by the semicon industry today. To solve this problem, TU Delft joined forces with ARCNL and ASML to push current boundaries in applying electron imaging instead of light imaging to inspect and
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such as vitality & wellbeing, mobility, smart & intuitive spaces and environmental monitoring. Communication networks provide the bedrock for digital transition of our society and economy. In 4G and 5G
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the Netherlands. The candidate is expected to closely collaborate with the project partners such as Vrije Universiteit, Saxion, TNO-ESI and industrial partners ASML, Canon Production Printers, ITEC, Philips, and