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technologies. The goal of this project is to find a reliable packaging technique for silicon chips with embedded microfluidic channels that does not involve the use of glue or elastomer seals. The project will
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compact InP coupons designed for heterogeneous integration onto silicon-based photonic platforms, enabling scalable co-integration with advanced photonic and electronic circuits. The developed technology
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. These new systems will support better medical imaging, faster computers, and greener high-tech manufacturing. Wafer handling: Silicon wafers are the base material for the fabrication of modern electronic
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circuits. Diamond/SiC color centers on large-scale photonics. Silicon color center physics and applications. You will be part of a team of talented PhD students and collaborate with top European and