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electron microscopy. PhD candidate 2 will use this fundamental understanding to extrapolate towards more complex textures, including entire lattices and guided by state-of-the-art nano-lithographies, in
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a state-of-the-art 4” processing line for III-V semiconductors, including an ASML DUV scanner, AIXTRON MOCVD G10 epitaxy reactor, electron beam lithography, diverse plasma etching tools, wafer-level
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formulations (e.g. hydrogels). Lithography for multiscale hierarchical 3D substrates, e.g. 3D nanoimprint, 3D deep UV or 3D X-ray lithography. Bottom-up tissue engineering based on micro and nanoengineered
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formulations (e.g. hydrogels). Lithography for multiscale hierarchical 3D substrates, e.g. 3D nanoimprint, 3D deep UV or 3D X-ray lithography. Bottom-up tissue engineering based on micro and nanoengineered
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. Appl. 20, (2023)], and work on an alternative EUV source solution [Mostafa, Appl. Phys. Lett. 123, (2023)]. Background The revolutionary introduction of EUV lithography was the culmination of several
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The revolutionary introduction of EUV lithography was the culmination of several decades of collaborative work between industry and science – a Project Apollo of the digital age. The short, 13.5-nm EUV wavelength
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spectroscopy) Device fabrication (cleanroom techniques, lithography) Low-temperature or high magnetic field experiments You have good communication skills and a strong command of English language (written and