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Transfer Surfaces. From the processor in your phone to the AI compute in a data centre, every high-power electronic device faces the same limit: heat. This has created an urgent demand for next-generation
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Funded (Scholarship not available. Fees & Materials to be paid by the student.) Where to apply Website https://forms.office.com/e/0hCcrv2Gkp Requirements Research FieldEngineering » Electronic
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multiple high-quality journal and conference publications and provide opportunities for collaboration with academic and industrial research partners. Supervisor https://www.tudublin.ie/explore/faculties-and
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multiple high-quality journal and conference publications and offers opportunities for collaboration with industrial partners and international research networks. supervisor https://www.tudublin.ie/explore