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Research Infrastructure? No Offer Description Join an international and multidisciplinary research team to explore and manipulate three-atom-thin semiconductors at the forefront of semiconductor technology
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Low cost and low power radar sensing systems Photovoltaics Power to Molecules Sensor solutions for Internet of Things Silicon photonics Solid state batteries System and IC design Thin-film flexible
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part of our research team and benefit from our vast experience on thin film deposition and characterization in the 2D realm [4]. In addition to the diffusion of the learning through publications, you
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(device, standard cell architecture, back-end of line, etc.) on the power, performance, and area of different SoCs (or submodules thereof). Throughout the physical design experiments, you analyze the impact
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wiring that takes care of the interconnection between logic standard cells at processor level. In advanced nodes, the most critical interconnect layers will be reduced to 20 nm pitches and below, requiring
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corrosion are becoming a challenging topic in many CMP processes. Wafer grinding – mainly used in 3D applications – thins down the wafer and can leave post-grinding defects that negatively impact device
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development of novel 2D halide perovskite materials and their evaluation in device structures (e.g., transistors, detectors, LEDs, solar cells). The influence of the interfaces in these devices on performance
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) and atomically thin complementary FETs (CFETs). (Fig1.) What you will do In this PhD research project, you will explore the nucleation and growth behavior of TMDCs with monolayer thickness control by
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for n-type and p-type doping respectively. Second, doping using low energy phosphorus implantation will be studied, controlling the implantation depth by means of sacrificial polymer films. As a third