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designs. Combining these classes raises issues around recyclability, interfacial adhesion, and mismatched thermal expansion that can induce stresses and affect lifetime performance. We invite a motivated
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15 Jul 2026 Job Information Organisation/Company Université de Limoges Department DRH-RECHERCHE Research Field Chemistry Researcher Profile First Stage Researcher (R1) Positions Postdoc Positions
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National Energy Technology Laboratory (NETL) | Morgantown, West Virginia | United States | about 13 hours ago
Organization National Energy Technology Laboratory (NETL) Reference Code NETL-Postdoc-2026-Seol How to Apply A complete application consists of: An application, including academic history, work
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National Energy Technology Laboratory (NETL) | Morgantown, West Virginia | United States | 30 days ago
Organization National Energy Technology Laboratory (NETL) Reference Code NETL-Postdoc-2026-Guenther How to Apply A complete application consists of: An application, including academic history, work
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partners. The model will represent the main structure of the process, including thermal behaviour and gas flows, key dynamics of the system apparatus, sensor and actuator dynamics, and relevant thermal and
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Researcher (R2) Positions Postdoc Positions Application Deadline 23 Aug 2026 - 23:00 (Europe/Lisbon) Country Portugal Type of Contract Temporary Job Status Full-time Hours Per Week 40 Is the job funded through
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10 Jul 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Electronic engineering Engineering » Thermal engineering Researcher Profile
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closely related discipline. Strong background in modeling and simulation of thermal/energy systems, preferably including PV/T or hybrid solar systems. Hands-on experience with thin-film deposition
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completing the doctoral degree. The position is a temporary employment with a maximum period of 3 years. The postdoc researcher position mainly involves research where the candidate will independently plan and
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of the following: electronic packaging, heterogeneous integration, thermal management, reliability, multi-physics and multiscale simulation. Demonstrated publication record in high-quality