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levels. For more information about IS2M, please visit the institute's website: https://www.is2m.uha.fr/ . The postdoctoral researcher will work within the Plasma Polymerization and Coatings team
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Institute of Plasma Physics and Laser Microfusion | Warsaw, Indiana | United States | about 2 months ago
: https://www.ifpilm.pl/praca-w-instytucie Work Location(s) Number of offers available 1 Company/Institute Institute of Plasma Physics and Laser Microfusion Country Poland City Warsaw Postal Code 01-497
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) / GaAlInAs quantum wells (400 nm) / InP contact layer (200 nm) / Si substrate The objective of the project is to develop a plasma etching process for this multilayer stack, enabling selective etch stopping on
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Description We have an opening for a Postdoctoral Researcher in the field of edge plasma physics for magnetic fusion devices. You will apply expertise in diagnostic design, construction, calibration
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researcher to conduct theoretical and computational research in fusion plasma physics. The successful candidate will contribute to key research areas within IFS, with a particular focus on gyrokinetic
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laser-matter research. You will plan, design, execute and oversee experiments in the fields of laser-plasma interactions, hydrodynamics, radiation transport, implosion physics, material strength and
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-matter research. You will plan, design, execute and oversee experiments in the fields of laser-plasma interactions, hydrodynamics, radiation transport, implosion physics, material strength and nuclear
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institutional approval) in complex plasma physics, starting in October 2026. The successful candidate will join Dr. Surabhi Jaiswal’s research group focusing on dust-plasma interaction under a high
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institutional approval) in complex plasma physics, starting in October 2026. The successful candidate will join Dr. Surabhi Jaiswal’s research group focusing on dust-plasma interaction under a high
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, and analyzing experiments to develop advanced plasma, vapor or combined plasma/vapor etch processes. Investigating novel process concepts, materials, and dry etch chemistries to address future device