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-Optimization (STCO) program you will interact with a wide range of research and engineering teams (from process to system architecture) to evaluate and provide system-level feedback to imec technology roadmaps
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field effects transistors (CMOSFET) [2]. The use of atomic thick material comes with new challenges. The bond free surfaces challenge the gate dielectric deposition process with classical techniques. Also
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new materials and disruptive integration schemes, process innovations and structural scaling boosters (hybrid metallization, semi-damascene metallization, buried power rails enabling interconnect
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processes and conditions to provide consistently effective results, utilizing windowing and process margin understanding. Legacy technology improvement and tech transfer: Support 28nm and 14nm technology
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Infrastructure? No Offer Description What you will do Work in the Platform Efficiency Department, as a Device Engineer. Support process integration efforts on the full range of department projects, by helping
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processes and conditions to provide consistently effective results, utilizing windowing and process margin understanding. Legacy technology improvement and tech transfer: Support 28nm and 14nm technology
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which are used across several of the programs at IMEC. Determine the optimal processes and conditions to provide consistently effective results, utilizing windowing and process margin understanding
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will work closely with the device design, characterization and process development engineers and be responsible for defining and implementing the process options enabling Laser co-integration with Si
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to evaluate defect results of window and margin test for modules. Feedback to help Integration and process to establish optimal settings which work across major program families which are inherently dissimilar
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developing new processes and for looking into the sustainability aspects of process step development. The team currently consists of ~12 people with whom you interact daily. However, you will also work in a