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23 Sep 2026 Job Information Organisation/Company Gustave Roussy Department INSERM U1279 Research Field Biological sciences » Biological engineering Physics » Biophysics Engineering » Biomedical
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18 Sep 2026 Job Information Organisation/Company Empa Research Field Computer science » Other Engineering » Electrical engineering Engineering » Mechanical engineering Engineering » Other Technology
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26 Sep 2026 Job Information Organisation/Company Okinawa Institute of Science and Technology Graduate University Research Field Chemistry Physics Astronomy Geosciences Mathematics Technology
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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Posting Description POSTDOCTORAL ASSOCIATE, Civil and Environmental Engineering, will carry out research to develop methods to estimate the economic and environmental impact of pavements and
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24 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Technology » Quantum technology Researcher Profile Recognised Researcher (R2) Application
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23 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Environmental science » Global change Environmental science » Water science Geosciences
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postdocs at the partner institutes and with TU Delft staff and PhD students working on HVDC, protection, wide-area stability and cyber-physical power systems. Progress is shared in regular consortium
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the internal application process. Welcome to The Ohio State University's career site. We invite you to apply to positions of interest. In order to ensure your application is complete, you must complete
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anatomy of the central nervous system. The current line of enquiry is to engineer human B cells to express a B cell receptor of interest in a way that enables native-like class switch, somatic hypermutation