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Electrical and Electronics Engineering, Materials Engineering, Applied Physics, Mechanical Engineering, or a related field. Prior hands-on experience with cleanroom processes, including lithography, PECVD
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-photonics and heterogeneous-integration projects, including wet cleaning, wafer cleaving/dicing and facet preparation. Run core process modules: e-beam/DUV/i-line lithography and ICP-RIE/RIE etch; PECVD/LPCVD
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Massachusetts Institute of Technology (MIT) | Cambridge, Massachusetts | United States | 2 months ago
optimize a broad range of fabrication processes; practical and theoretical familiarity with many process categories (e.g. lithography,ALD, ALE, plasma etching, PECVD deposition, diffusion, etc.), but in
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theoretical familiarity with many process categories (e.g. lithography,ALD, ALE, plasma etching, PECVD deposition, diffusion, etc.), but in-depth knowledge of ALD and/or plasma etching is required; expertise in
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. Experience with technologies such as PVD, sputtering, evaporation, PECVD, plasma etching or related semiconductor fabrication processes would be highly regarded. Demonstrated experience independently managing
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limited to ICP and RIE etchers, PECVD, LPCVD and PVD as well as ALD and relevant in-line characterization equipment (SEM, AFM, XRD, XPS, ellipsometry). You will interact with and advise both academic and
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technique, such as PVD, PECVD, ALD, spin-coating, electropolymerization, or any equivalent method. Expertise in electrical and electrochemical characterization techniques is required, ideally including
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. Developing bottom cells at different scales (from 1 by 1 cm2 to 6 by 6 inch2) utilizing the PECVD-PVD cluster. Performing device characterization, and modeling aimed at champion PCEs. Manage project tasks
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to photolithography, thin film deposition (CVPD and PECVD), oxidation, activation, testing & metrology, wet process, epitaxial growth, Plasma etch, metal deposition, ion implantation, and process support utilities