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The School of Mechanical & Aerospace Engineering (MAE) is a robust, dynamic and multi-disciplinary international research community comprising of world-class scientists and bright students. MAE
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materials, systems engineering, computational chemistry, catalysis, energy, process design and optimization, AI applications in Chemical Engineering and other fields relevant to Chemical Engineering
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Optics/Photonics, Electrical Engineering or a closely related field. Strong hands-on experience with free-space optical systems, including optical alignment, optimization, and troubleshooting. Solid
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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | 1 day ago
Temporary Staff (SHRA) Position Title Data Engineer Position Number 20075448 Vacancy ID S028125 Full-time/Part-time Full-Time Temporary Hours per week 40 Work Schedule Position Location North Carolina, US
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Inria, the French national research institute for the digital sciences | Gif sur Yvette, le de France | France | 12 days ago
optimization. Specific Requirements We are looking for a motivated and talented student following an engineering degree or a Master's 2 specializing in data science / artificial intelligence / image processing
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the production processes applied to ceramics and surface treatments in order to produce objects with the desired properties. The company ELKEM (https://www.elkem.com/ ) is a supplier of raw materials and mineral
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School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built on a culture of excellence, the School is renowned for its high academic
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Location(s) Number of offers available1Company/InstituteSwiss Federal Institute of Technology Lausanne, EPFLCountrySwitzerlandCityLausanne Contact City 1015 Lausanne Website https://www.epfl.ch Street
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markets • Optimal planning of electric power systems For more information on the research group of Professor Papavasiliou, interested applicants are encouraged to consult the following link: https://ap
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-world applications. Position Overview We are seeking a Junior Process Engineer in PIC Packaging, to support the development of assembly and interconnect technologies for Photonic Integrated Circuits (PICs