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population of about 3,600 passionate students, the Faculty of Applied Sciences is an inspiring scientific ecosystem. Focusing on key enabling technologies, such as quantum- and nanotechnology, photonics
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31 Jul 2026 Job Information Organisation/Company CNRS Department Centre de Nanosciences et de Nanotechnologies Research Field Physics Researcher Profile Recognised Researcher (R2) Application
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IT4Innovations National Supercomputing Center, VSB - Technical University of Ostrava | Czech | 2 months ago
from Czech Republic, and abroad. Postdoc – Quantum Thermal Modelling for Nanotechnologies Lab Activity description: conduct research aligned with the candidate’s scientific interests and preliminary
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for nanofabrication of quantum devices. You will join a diverse and enthusiastic team of academic staff, PhD students and postdocs in the Steele Lab in the Quantum Nanoscience Department in Delft. You will meet
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Postdoc Positions Application Deadline 21 Sep 2026 - 23:59 (Europe/Madrid) Country Spain Type of Contract Temporary Job Status Full-time Hours Per Week 37,5 Offer Starting Date 1 Nov 2026 Is the job funded
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scientific ecosystem. Focusing on key enabling technologies, such as quantum- and nanotechnology, photonics, biotechnology, synthetic biology and materials for energy storage and conversion, our faculty aims
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ecosystem. Focusing on key enabling technologies, such as quantum- and nanotechnology, photonics, biotechnology, synthetic biology and materials for energy storage and conversion, our faculty aims to provide
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8 Jul 2026 Job Information Organisation/Company Institut Català de Nanociència i Nanotecnologia Research Field Chemistry Researcher Profile Recognised Researcher (R2) Positions Postdoc Positions
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, spanning fields such as neuroscience and cognition, humanoid technologies and robotics, artificial intelligence, nanotechnology, and material sciences, offering a truly interdisciplinary scientific
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked