Sort by
Refine Your Search
-
Listed
-
Category
-
Country
-
Program
-
Employer
- City University of Hong Kong
- UNIVERSITY OF MACAU
- Princeton University
- Fraunhofer-Gesellschaft
- National University of Science and Technology POLITEHNICA Bucharest
- ;
- NIST
- North Carolina State University
- Delft University of Technology (TU Delft)
- Nanyang Technological University
- University of Texas at Austin
- Argonne
- CNRS
- National University of Singapore
- Rochester Institute of Technology
- University of Sheffield
- University of Utah
- Arizona State University
- Pennsylvania State University
- Purdue University
- University of California
- University of Illinois at Urbana Champaign
- University of Southern California
- City University of Hong Kong (Dongguan)
- European Space Agency
- National Hellenic Research Foundation
- Oak Ridge National Laboratory
- THE UNIVERSITY OF HONG KONG
- University of California, Merced
- University of Florida
- University of Sheffield;
- AALTO UNIVERSITY
- Boise State University
- City University of Hong Kong (Donguan)
- DAAD
- ETH Zurich
- ETH Zürich
- Ghent University Global Campus
- Grenoble INP - Institute of Engineering
- Indiana University
- Iowa State University
- King Abdullah University of Science and Technology
- McGill University
- Montanuniversität Leoben
- Poznan University of Technology
- Rutgers University
- SINGAPORE INSTITUTE OF TECHNOLOGY (SIT)
- Shenzhen University of Advanced Technology
- Technical University of Munich
- Texas A&M University System
- University College Dublin
- University of Macau (UM)
- University of Zagreb, Faculty of Electrical Engineering and Computing
- Łukasiewicz Research Network - Institute of Microelectronics and Photonics
- Aalborg University
- Brown University
- Brown University School of Engineering
- CNR IMM
- CNRS IEMN
- CNRS-LIRMM
- Chapman University
- ESRF - European Synchrotron Radiation Facility
- Foundation for Research and Technology
- George Mason University
- Georgia Southern University
- Great Bay University
- Harvard University
- Helmholtz Association of German Research Centres
- Helmholtz Zentrum München - Deutsches Forschungszentrum für Gesundheit und Umwelt
- Heriot Watt University
- Huazhong Agricultural University (HZAU)
- IMEC
- INSA Strasbourg
- Instituto de Telecomunicações
- King's College London
- Laboratory of Computer Science, Robotics and Microelectronics of Montpellier (LIRMM) and Alternative Energies and Atomic Energy Commission (CEA)
- Lulea University of Technology
- Luleå University of Technology
- MOHAMMED VI POLYTECHNIC UNIVERSITY
- Marquette University
- Massachusetts Institute of Technology
- Max Planck Institute for Solar System Research, Göttingen
- SUNY
- SUNY University at Buffalo
- THE HONG KONG POLYTECHNIC UNIVERSITY
- Technical University of Denmark;
- Temple University
- The Chinese University of Hong Kong
- UNINOVA - Instituto de Desenvolvimento de Novas Tecnologias
- UNIVERSIDAD POLITECNICA DE MADRID
- Universidad Carlos III de Madrid
- University College Cork
- University of Bath
- University of Bremen •
- University of British Columbia
- University of California Los Angeles
- University of Connecticut
- University of Copenhagen
- University of Delaware
- University of Glasgow
- 90 more »
- « less
-
Field
-
or equivalent Specific Requirements Any national, foreign and stateless candidate(s) holding a doctorate degree in Electrical/Electronic Engineering, Telecommunications, Photonics, Microelectronics, Physics
-
degree in Electrical Engineering, Electronics, Microelectronics, or a related field Prior experience in applied electromagnetics and antenna designs Prior experience in printed-circuit board (PCB) design
-
, Microelectronics, or a related field Prior experience in analog, digital, and mixed-signal IC circuit design, with familiarity with IC design tools and tapeout flows, including digital circuit synthesis Prior
-
performance and other relevant materials properties. The research will take place in the Electronic Components, Technology and Materials section of the Microelectronics Department. Within the consortium, also
-
technical areas, including AI-enabled systems engineering, microelectronics and hardware security, space and radiation-tolerant systems, advanced materials, and biosecurity. Translate sponsor priorities and
-
microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. Our Impact Backed by $1.4 billion in combined funding from DARPA, Texas state
-
% Programming and implementation of sensors in microelectronics, 30%; Experience in modelling real-life system for control, 30%; The final classification of the applicant’s merit with the achieved through
-
engineering bio-statistics and AI-healthcare smart/semi-conductor manufacturing AI/robotics/autonomous systems aerospace and microelectronics engineering energy generation and storage digital business and
-
section of the Microelectronics Department. Within the consortium, also other academic, research and industrial partners are present with whom there can be opportunities to collaborate. Job requirements You
-
EnergyEngineering, the Faculty of Biomedical Engineering andthe Faculty of Computility Microelectronics, in addictionto a number of research institutes including the Instituteof Cell and Gene Technology, the