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Postdoctoral Associate Required Qualification: (as evidenced by an attached resume) Ph.D.(or foreign equivalent) in Mechanical Engineering, Electrical Engineering, Computer Science, Robotics, or a
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked
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We are seeking two full-time Postdoctoral Research Assistants to join the BOLD Lab at the Department of Engineering Science (central Oxford). The post is funded by EPSRC and is fixed-term for 12
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molecular data using advanced computational and statistical approaches to identify early biomarkers of neurodegeneration. Qualifications: PhD in Biomedical Engineering, Neuroscience, Neuroimaging, Physics
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—and improving their treatment through data-driven, empirically grounded approaches. We are interested in the intersection of technology, mental health, and data science in clinical psychology. The lab
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5 Sep 2026 Job Information Organisation/Company Luleå University of Technology Research Field Engineering Researcher Profile First Stage Researcher (R1) Application Deadline 30 Sep 2026 - 12:00 (UTC
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Postdoctoral Associate Required Qualification: (as evidenced by an attached resume) Ph.D. (or foreign equivalent) in Mechanical Engineering, Civil Engineering, Electrical Engineering, Computer
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18 Sep 2026 Job Information Organisation/Company University of Twente (UT) Research Field Engineering » Materials engineering Engineering » Mechanical engineering Researcher Profile Recognised
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EPFL, the Swiss Federal Institute of Technology in Lausanne, is one of the most dynamic university campuses in Europe and ranks among the top 20 universities worldwide. The EPFL employs more than
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12 Sep 2026 Job Information Organisation/Company Delft University of Technology (TU Delft) Research Field Engineering » Electrical engineering Researcher Profile Recognised Researcher (R2