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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | 12 days ago
Posting Information Posting Details Department Lampe Biomedical Engineering - 424601 Posting Open Date 09/10/2026 Application Deadline 09/23/2026 Open Until Filled No Position Type Postdoctoral
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University of North Carolina at Chapel Hill | Chapel Hill, North Carolina | United States | about 4 hours ago
Posting Information Posting Details Department Lampe Biomedical Engineering - 424601 Posting Open Date 09/10/2026 Application Deadline 10/07/2026 Open Until Filled No Position Type Postdoctoral
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11 Aug 2026 Job Information Organisation/Company School of Agriculture (FCA) – UNESP Research Field Agricultural sciences Biological sciences Technology Engineering Researcher Profile First Stage
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derive scientifically sound recommendations for technology, infrastructure, and policy development In addition, your responsibilities as a Postdoc/Senior Scientist include: A completed university degree in
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of new treatments including in vitro and in vivo proof-of-concept efficacy data. This is an opportunity to work across multiple disciplines spanning retinal biology, viral vector technology and
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Massachusetts Institute of Technology | Cambridge, Massachusetts | United States | about 2 months ago
; understanding of the potential career trajectories of postdocs in science and engineering; familiarity with career services’ online technology/management systems; knowledge of career development theory and the
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. DUTIES The postdoc will perform gas fermentation experiments in both bottle and bioreactor cultures to phenotype various carbon oxide (CO or CO2) fixing native and engineered microbial strains
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. Bert Koopmans, based at Eindhoven University of Technology. PhD candidate 1 will explore fundamental processes underlying the deterministic creation and annihilation of sub-diffraction limited skyrmions
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Do you have an ambitious research idea that you wish to pursue in your postdoc? Are you interested in theoretical or computational science in an interdisciplinary environment? Then HITS is the
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Vacancies PostDoc position on Wafer Bonding Physics for 3D Chip Integration Key takeaways Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked