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Field
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, including standard photolithography and high-precision electron-beam/nano-lithography. Lead thin-film depositions using E-beam evaporation and sputtering systems for both dielectrics and metals. Develop and
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Previous hands-on experience with semiconductor device fabrication, including e-beam lithography, optical lithography, atomic layer deposition, thin film metals deposition, scanning electron microscopy
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with our industry partner ASML—the major player in the semiconductor lithography sector—to harness new techniques in nonlinear optics in gas-filled fibres to develop light sources with unique properties
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ferroelectric and other functional materials into photonic architectures for electro-optic and quantum transduction applications Perform full device processing using cleanroom techniques, including electron-beam
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-transfer printing. You will be responsible for: Developing novel fabrication methods for solid laser waveguides (e-beam lithography / dry-etch optimization / thin-film development) Testing and characterizing
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growth of thin films using CVD and related technique is preferred. Other knowledge of pulsed-laser deposition, sputtering deposition, photo- and electron beam lithography, and transport and
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room has unique equipment for heterogeneous laser integration and micro-transfer printing. You will be responsible for: Developing novel fabrication methods for solid laser waveguides (e-beam lithography
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following areas: Transition-edge sensors (TESs) or kinetic inductance detectors (KIDs) Cleanroom microfabrication processes, including: Thin-film deposition (e.g., magnetron sputtering) Electron-beam
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demonstrated skills in the following areas: (i) Fabrication of 2D materials based nanodevices using exfoliation, transfer, optical and electrical beam lithography (EBL). Strong command of EBL is required. (ii
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. Experience with TEM, including Lorentz TEM and in-situ cryo experiments. Experience with nanofabrication (e.g., focused ion beam, electron-beam lithography and photolithography), transport measurements and