-
probes for cryo- SPM Development and optimization of wafer-scale micro- and nanofabrication processes, including integration of sensing, actuation and electrical functionalities Mechanical, electrical and
-
to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
-
to 3D transistor architectures and stacked, hybrid-bonded devices, it becomes important to study the initiation and propagation of defects due to thermal and electrical phenomena (e.g., dielectric
-
training costs are exploding, largely due to energy and bandwidth inefficiencies in current electrical datacenters. Our group is developing a novel Optical Circuit Switched (OCS) architecture
-
to 3D transistor architectures and stacked, hybrid-bonded devices, non-destructive, high-resolution 3D imaging is becoming a necessity. Unfortunately, current 3D X-ray nanoimaging methods
-
/2603.06760 . A potential target application is the design of model gliders to compete in FAI competitions such as https://www.fai.org/page/f5-electric-flight . Profile Potential candidates are expected to have
-
candidates with a PhD degree in computational biology, AI, computer science, electrical engineering, physics or applied maths, and with a strong aspiration for collaborative research of impact in biology or
-
to the technical and quantitative training of junior lab members. Candidate profile Applicants should have a PhD in biomedical engineering, electrical engineering, computer science, data science, computational